From: Zhang Rui <rui.zhang@intel.com>
Date: Mon, 13 May 2019 13:58:51 -0400
Subject: powercap/intel_rapl: Support multi-die/package
Git-commit: 32fb480e0a2cf1f71e4174d6477198c94dbc746c
Patch-mainline: v5.3-rc1
References: jsc#SLE-5454

RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.

Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present.  No change on single
die/package systems.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Link: https://lkml.kernel.org/r/9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.com
Signed-off-by: Jiri Slaby <jslaby@suse.cz>
---
 drivers/powercap/intel_rapl.c |    4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -264,7 +264,7 @@ static struct rapl_domain *platform_rapl
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package_domain(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1461,7 +1461,7 @@ static void rapl_remove_package(struct r
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;